
H176 - Hot Melt Adhesive
Applications
- Designed to bond case & carton sealing, & tray forming
- Ideal for sealing polystyrene foam and polyethylene foam
Specifically engineered for industrial applications, this product delivers optimal performance in demanding environments.
Benefits
- Bonds well to a wide variety of board, paper stock, and foam.
- Excellent heat stability
- Low viscosity
- Aggressive tack
- Meets federal regulation 21 CFR 175.105
Technical Data
Chemistry
N
NA
Specialized chemistry for optimal performance in various applications.
No technical data available for this product.
Available Sizes
25 Lbs
Ready to Get Started
Contact our technical team for expert guidance and support with your application.



