H176 - Hot Melt Adhesive
Applications
- Designed to bond case & carton sealing, & tray forming
- Ideal for sealing polystyrene foam and polyethylene foam
Specifically engineered for industrial applications, this product delivers optimal performance in demanding environments.
Benefits
- Bonds well to a wide variety of board, paper stock, and foam.
- Excellent heat stability
- Low viscosity
- Aggressive tack
- Meets federal regulation 21 CFR 175.105
Technical Data
Chemistry
N
NA
Specialized chemistry for optimal performance in various applications.
No technical data available for this product.
Available Sizes
25 Lbs
Related Products
More industrial solutions
H103 - Hot Melt Adhesive
H117 - Hot Melt Adhesive
H158 - Hot Melt Adhesive
H163 - Hot Melt Adhesive
Ready to Get Started
Contact our technical team for expert guidance and support with your application.